Abstract
The wet screen printing process can be modelled by paste being pushed through a mesh onto a substrate and conductors below. During the process defects, such as vias, voids, pinholes, craters and bubbles can form and evolve. The primary objective of the Study Group was to know how best to alter the properties of the paste (rather than the geometry of the screen printing process itself) in order to eliminate the defects. With these goals in mind this report describes a simple model for the closure of craters, a model for the partial closure of vias, a possible mechanism for the formation of pinholes and finally a more detailed consideration of the screen printing process.
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